Probe with trapezoidal contactor and device based on application thereof, and method of producing them

ABSTRACT

A probe is disclosed, comprising a beam  4 B, which has a front end  4   b   1 , an intermediate portion  4   b   2  and a base end  4   b   3 , the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor  4 A, which is fixed to the leading end  4   b   1  of the beam.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and is based upon and claims thebenefit of priority under 35 U.S.C. §120 for U.S. Ser. No. 10/502,099,filed Jul. 22, 2004, and claims the benefit of priority under 35 U.S.C.§ 119 from a National Stage of PCT/JP02/12984, filed Dec. 11, 2002,Japanese Patent Application No. 2002-12426, filed Jan. 22, 2002, theentire contents of each which are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a probe used for inspecting electricalcharacteristics of semiconductor devices having a shape of, e.g., asemiconductor wafer, a method for manufacturing the probe, a probearray, a method for manufacturing the probe array, a method forattaching the probe, an apparatus for attaching the probe, a probe cardand a probe array maintenance unit.

BACKGROUND OF THE INVENTION

A probe card is used to inspect electrical characteristics of a testsubject, for example, a semiconductor device (IC chip) such as a memorycircuit or a logic circuit, formed on a semiconductor wafer(hereinafter, referred to as a wafer for simplicity) in large numbers.The probe card includes a plurality of probes, each of the probes beinginstalled to be correspondent to a plurality of electrode pads formed onthe test subject (for example, IC chip). Each probe makes an electricalconnection between a tester and the IC chip by contacting electricallywith the electrode pad of the IC chip, thereby rendering inspectionsignals delivered between the tester and the IC chip.

Recently, an array of the electrode pads becomes narrow-pitched as theIC chip is highly integrated, thereby an array of the probes becomingnarrow-pitched. The probe card has been proposed to accommodate such atrend of the narrow pitching of the probes in, e.g., Japanese Laid-openPublication No. 8-50146 or No. 11-133062.

Technologies disclosed therein are all based on a lithography technologyand using same. In the technologies, to arrange the probescorrespondently to an array of the plurality of inspecting electrodes,the plurality of probes are formed simultaneously on a surface of acontactor substrate made of, e.g., a ceramic, silicon or the like. Theprobe installed in the probe card includes a contactor electricallycontacting with, e.g., the inspecting electrode and a beam maintainingthe contactor at a leading end thereof. The probes are arranged on thecontactor substrate in a predetermined array, thereby making each of aplurality of contactors electrically contact with a different one of theinspecting electrodes.

However, to adopt the lithography technology, a photomask needs to havea pattern corresponding to an array pattern of the probes in the probecard. In other words, the probes should be manufactured by using thespecific photomask. Further, the probe includes a plurality of parts,e.g., the contactor and the beam. To manufacture the plurality of parts,a plurality of photomasks needs to be provided. Lately, the number ofkinds of the test subject increases in an era of small quantity batchproduction. It is required that the probe card should be appropriatelyused for each of the various kinds of the test subjects, the number ofwhich increases nowadays. Accordingly, the required number of thephotomasks increases greatly such that lots of time and cost are neededfor manufacturing the photomasks, thereby also increasing the cost formanufacturing the probe card.

SUMMARY OF THE INVENTION

It is, therefore, an object of the present invention to provide asolution to at least one of the problems described above. In accordancewith one aspect of the present invention, it is a primary object of thepresent invention to provide a probe and a method for the manufacturethereof which may be commonly and generally used for the probe cards,each of which having a different array pattern of the probes.

In accordance with another aspect of the present invention, it isanother object of the present invention to provide a probe and a methodfor the manufacture thereof to make a small quantity of many kinds ofthe probe cards.

In accordance with still another aspect of the present invention, it isstill another object of the present invention to provide a probe and amethod for manufacturing the probe card, which do not require thevarious kinds of photomasks.

In accordance with still another aspect of the present invention, it isstill another object of the present invention to provide a probeattaching method and a probe attaching apparatus for manufacturingdifferent kinds of probe cards at a low cost by attaching each of probesbased on the array pattern of the probes necessitated by the probe card.

Hereinafter, still other objects and advantages of the present inventionwill be described in the specification below and a portion of theobjects and advantages may be obvious from a disclosure therein orachievable by an execution of the present invention. The objects andadvantages of the present invention mentioned above may be executed andachieved by each means and a combination thereof particularly describedherein.

In accordance with a first aspect of the present invention, there isprovided a probe which contacts with an electrode of a test subjectformed on a substrate and is used for inspecting electricalcharacteristics of the test subject. The probe includes:

a beam (the beam includes a leading end, an intermediate portion andbase end, the leading end being a portion making a contact with the testsubject via a contactor and the base end being the portion fixing theprobe), and

a contactor having a substantially trapezoidal shape (the contactor isinstalled at the leading end of the beam).

The probe provided by the first aspect of the present inventionpreferably further includes [a] and [b] or a combination thereof:

[a] The trapezoidal shape of the contactor that is a substantiallysquare coned trapezoidal shape.

[b] The beam that is bent toward the contactor at the base end or theintermediate portion thereof.

In accordance with a second aspect of the present invention, there isprovided a method for manufacturing the probe in accordance with thefirst aspect of the present invention by using the lithographytechnology, the method including the steps of:

forming on a silicon substrate a plurality of recessed portions (grooveportions), each having a substantially trapezoidal shape, by using ananisotropic etching technique (herein, an area of a top surface of thetrapezoidal shape is controlled by adjusting an etching time); and

forming a plurality of probes by using a film forming technique on thesilicon substrate (herein, a contactor is formed inside each recessedportion having the trapezoidal shape and at the same time the beam isformed on the silicon substrate together with the contactor as a singlebody).

The method for manufacturing the probe provided by the second aspect ofthe present invention preferably further includes the step of [c] below:

[c] forming a peeling layer at least on a portion of a surface of thesilicon substrate where the probes are formed after the step of formingthe plurality of recessed portions having the trapezoidal shape on thesilicon substrate.

In accordance with a third aspect of the present invention, there isprovided a probe array that is used in a manufacturing process of aprobe card. The probe array includes:

a second film-shaped supporting body; and

a plurality of probes, each being recited in claim 1, adhered onto onesurface of the second film-shaped supporting body.

The probe array provided in accordance with the third aspect of thepresent invention preferably further includes [d] to [f] below or acombination thereof:

[d] At least portions of one surface of the second film-shapedsupporting body where the probes are attached having an adhesiveproperty, and an adhesive strength thereof that can be varied by heat orultraviolet light.

[e] For each beam of a plurality of probes, a beam surface where acorresponding contactor is installed being adhered to the surface of thesecond film-shaped supporting body having an adhesive property, and

[f] The plurality of probes being arranged in various directions on afilm.

In accordance with a forth aspect of the present invention, there isprovided a method for manufacturing the probe array. The method includesthe steps of:

[1] forming the plurality of probes on the silicon substrate by themanufacturing method in accordance with the second aspect of the presentinvention;

[2] transferring the plurality of probes formed on the silicon substrateonto one of surfaces of a first film-shaped supporting bodysimultaneously;

[3] deteriorating an adhesive property of the surface of the firstfilm-shaped supporting body; and

[4] transferring the plurality of probes onto said one surface of thesecond film-shaped supporting body by adhering the latter onto said onesurface of the first film-shaped supporting body.

The method for manufacturing the probe array preferably further includes[g] to [h] below or a combination thereof:

[g] One surface of the first film-shaped supporting body having theadhesive property, wherein an adhesive strength thereof can be varied byheat or ultraviolet light;

[h] The forming step [1] further including the following steps:

[1a] forming a peeling layer on the silicon substrate prior to formingthe plurality of probes on the silicon substrate; and

[1b] eliminating parts of the peeling layer prior to transferring theplurality of probes formed on the silicon substrate onto one surface ofthe first film-shaped supporting body simultaneously.

In accordance with a fifth aspect of the present invention, there isprovided a method for attaching a base end of a probe to a supportingcolumn placed on a card shaped substrate. The method includes:

installing the base end of the probe having the trapezoidal contactorand accommodated in a probe array on an attaching contact surface of thesupporting column on the card shaped substrate; and

fixing the base end of the probe to the supporting column.

The attaching method provided by the fifth aspect of the presentinvention preferably includes the step of fixing the base end of theprobe to the supporting column by pressing a leading end of anultrasonic bonder against an upper side of the base end of the probe(herein, the leading end of the ultrasonic bonder has a crossedprotrusion, a cross section of the protrusion being of a substantiallysemicircle, and a beam of the probe is bent toward the contactor byfixing the base end of the probe to the supporting column by using theultrasonic bonder).

In accordance with a sixth aspect of the present invention, there isprovided an apparatus for attaching a base end of a probe having atrapezoidal contactor to a card shaped substrate. The apparatusincludes:

a unit for installing the base end of the probe arranged in the probearray to an upper portion of the supporting column of the substrate;

a unit for fixing the base end of the probe to the supporting column.

The attaching apparatus provided by the sixth aspect of the presentinvention preferably further includes [i] and [j] or a combinationthereof:

[i] The fixing unit being an ultrasonic bonder having the leading end,the leading end thereof being equipped with the protrusion. [j] Theprotrusion at the leading end of the ultrasonic bonder substantiallyhaving a formation that semi-cylinder shaped protrusions are crossingeach other.

In accordance with a seventh aspect of the present invention, there isprovided a probe card having a plurality of probes. The probe cardincludes:

a probe card main body (the probe card main body has a first surface anda second surface, a plurality of first terminals being installed on thefirst surface thereof, a plurality of second terminals being installedon the second surface thereof, wherein each of the second terminals isconnected to a different one of the supporting columns electrically, anda first terminal is the supporting column); and

a plurality of probes having a substantially trapezoidal contactor (thebase end of each probe is fixed to a different one of supportingcolumns).

The probe card provided by the seventh aspect of the present inventionpreferably further includes [k] and [o] or a combination thereof:

[k] A contactor of each probe substantially having a form of a squareconed trapezoid;

[l] The probe being bent toward the contactor at a place between a baseend and an intermediate portion thereof;

[m] The probe card main body further including a stopper;

[n] The stopper being made of a same material as the supporting columnand having an electric insulating film on a peripheral surface thereofincluding a contact surface with a surface of a test subject; and

[o] The probe card main body including a plurality of alignment marks onthe first surface thereof.

In accordance with an eighth aspect of the present invention, there isprovided a probe array supporting unit for supporting the probe arraywith a predetermined tension. The probe array supporting unit includes:

a first fixing part (the first fixing part is a first frame shapedstructure);

a second fixing part (the second fixing part is a second frame shapedstructure and is overlapped with the first fixing part via the probearray, herein, while the second fixing part is overlapped with the firstfixing part, the probe array described in claim 6 being supported byboth fixing parts under a predetermined tension); and

a locking part (the locking part locks and fixes the overlapped firstand second fixing parts).

The probe array supporting unit preferably further includes [p] below:

[p] The first fixing part being a first frame shaped structure having afirst lower surface and a first upper surface, wherein the first uppersurface is a first slant surface declining from an outer circumferenceto an inner circumference of the first frame shaped structure; and

the second fixing part (the second fixing part is piled on the firstfixing part and is a second frame shaped structure having a second lowersurface and a second upper surface, wherein the second lower surface isa second slant surface declining from an outer circumference to an innercircumference of the second frame shaped structure and substantiallyhaving a same slant angle as that of the first slant surface).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a sectional view of a probe card having a probe inaccordance with an embodiment of the present invention, and FIG. 1Billustrates an operation when the probe card shown in FIG. 1A performsan inspection of a wafer;

FIG. 2A presents a planar view of a surface of the probe card shown inFIG. 1A, the probe being arranged thereon, and FIG. 2B is a planar viewof an opposite surface thereof presented in FIG. 2A;

FIG. 3 describes a magnified sectional view of a portion of the probecard shown in FIG. 1;

FIG. 4A depicts a planar view of a silicon substrate on which the probesare framed and FIG. 4B shows a magnified sectional view of the probedepicted in FIG. 4A;

FIGS. 5A to 5G illustrate a process of transferring the probes formed onthe silicon substrate, onto an adhesive resin film;

FIG. 6 represents a side view of a probe attaching apparatus inaccordance with an embodiment of the present invention;

FIG. 7 provides a planar view of the probe attaching apparatusrepresented in FIG. 6;

FIGS. 8A to 8E illustrate a process of attaching the probe to the probecard by using the probe attaching apparatus represented in FIG. 6;

FIG. 9 offers a sectional view of a probe array supporting unit inaccordance with another embodiment of the present invention;

FIG. 10 shows a sectional view of a probe array supporting unit inaccordance with still another embodiment of the present invention;

FIG. 11 depicts a sectional view of a probe array supporting unit inaccordance with still another embodiment of the present invention;

FIG. 12 presents a sectional view of a probe array supporting unit inaccordance with still another embodiment of the present invention;

FIGS. 13A to 13D illustrate a process of attaching the probes to theprobe card by using the probe attaching apparatuses shown in FIG. 6 andFIG. 14;

FIG. 14 shows a leading end of an ultrasonic bonder in accordance withanother embodiment of the present invention; and

FIG. 15A offers a sectional view of a contactor having the probe inaccordance with the present invention and FIG. 15B illustrates anexemplary operation while the probe card shown in FIG. 15A performs aninspection of a wafer.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention is described in accordance with afirst embodiment with reference to FIGS. 1 to 8E.

A probe in accordance with the present invention is not only used to beattached to a probe card, but also may be adopted for various usagessuch as a probe to be attached as a terminal for diverse measurementdevices, a terminal of an electronics circuit, and the like. Herein,from an aspect of explaining the probe of the present invention moreconcretely, the probe attached to the probe card will be described.However, the probe in accordance with the present invention is notlimited to a usage for being attached to the probe card. An embodimentof the probe card to which the probe of the present invention isattached will now be described with reference to FIGS. 1 to 3.

As shown in FIGS. 1A, 1B and FIGS. 2A, 2B, the probe card 1 includes acard shaped substrate (hereinafter, referred to as a probe card mainbody) 2, and the probe card main body 2 has a first surface 1 a and asecond surface 1 b. On the first surface thereof, installed is aplurality of supporting columns 3 (hereinafter, referred to as a bump)connected to the probes electrically. On the second surface thereof,installed is a plurality of second terminals 7. Each of the bumps isconnected to a different one of the second terminals by a wiring layer 6electrically. The bumps 3 and the second terminals 7 are preferably madeof a conductive metal (e.g., copper).

The probe card main body 2 includes a plurality of probes 4. Each of theprobes 4 includes a beam 4B and a contactor 4A and the beam 4B has aleading end 4 b 1, an intermediate portion 4 b 2 and a base end 4 b 3.The contactor 4A is installed at the leading end 4 b 1 of the beam 4B.The contactor 4A preferably has a form of a trapezoid. A top portion ofthe contactor having the trapezoidal form may have various forms such asa flat plate, a hemisphere (having a semi-diameter of, e.g., 10 μm) anda plate having some irregularities. The contactor 4A having thetrapezoidal form may contact with the electrode of the test subject. Foreasiness of a manufacturing, it is preferable that the contactor hassubstantially a square coned trapezoidal form. The contactor having thesquare coned trapezoidal form may be easily manufactured by using asilicon substrate.

The base end 4 b 3 of the beam 4 is fixed at the bump 3 and electricallyconnected thereto and, consequently, the contactor 4A is connected tothe second terminal 7 electrically via a path of the beam 4B, the bump 3and the wiring layer 6. The second terminal 7 may be connected to atester T.

The probe card main body 2 may further include a stopper 5. The stopper5 may be installed to control a contact pressure (probe pressure), whena plurality of probes 4 contact the electrodes of a test subject(hereinafter, referred to as an IC chip) during an inspection thereof.In the mean time, the stopper 5 may be installed to mitigate an impactof a collision or a contact between a main chuck and the probe card mainbody 2, when a wafer W loaded on the main chuck is lifted toward theprobe card main body 2.

By having contact with each electrode pad W1 (made of a conductivemetal, e.g., aluminum, gold, etc.) of the IC chip formed on the wafer W,the contactor 4A of the probe 4 connects the IC chip to the tester viathe above-described path. Consequently, there may be inspectedelectrical characteristics of a plurality (for example, 16 or 32) or oneof IC chips formed on the wafer W. The probe card main body 2 may beformed approximately as a shape of circle, which is shown in FIGS. 2Aand 2B. At a central area 2A of a surface of the probe card main body 2,four regions 2A may be arranged, thereby a plurality of probes arrangedradially in each of regions, for example as shown in FIG. 2A.

Each of a plurality of probes 4 may be arranged radially such that thebase end 4 b 3 contacting with the bump 3 faces an inner side thereofand the leading end 4 b 1 where the contactor 4A is provided faces anouter side thereof. In the radial arrangement above, conversely, theleading end 4 b 1 and the base end 4 b 3 may face the inner side and theouter side thereof, respectively. At a peripheral region 2B of a reversesurface of the probe card main body 2, a plurality of second terminals 7are arrayed in a shape of ring and each second terminal 7 may beconnected to the bump 3 electrically via the wiring layer 6 as shown inFIG. 2B.

Each of the plurality of probes 4 includes the contactor 4A having asubstantially trapezoidal form, more preferably square coned trapezoidalform and the beam 4B combining a lid to maintain the contactor 4A at theleading end (freedom end) 4 b 1. The contactor 4A may have a top portionof various forms such as a flat plate, a hemisphere (having asemi-diameter of, e.g., 10 μm) and a plate having some irregularities.The contactor 4A and the beam 4B of the probes 4, each of probes havingcontact with a different one of a plurality of electrode pads W1 of theIC chip formed on the wafer W, may be preferably made of a conductivemetal (e. g, nickel) as a single body, which is of higher hardness thanthat of the electrode pad W1 on the wafer W. Furthermore, the contactor4A and the beam 4B are preferably made of a material having anelasticity (e.g., nickel). In an inspection state shown in FIG. 1B, eachof the plurality of contactors 4A of the probes 4 contacts with adifferent one of the plurality of electrode pads W1 of the IC chipformed on the wafer W. Each of contactors 4A is preferably pressedagainst each of electrode pads with a probe pressure larger than orequal to 1.5 g/unit in the inspection state shown in FIG. 1B. The probepressure is generally controlled by an elasticity force of the pluralityof beams 4B and a gap between the contactor 4A and the electrode of theIC chip. However, when the stopper 5 is adopted, the stopper 5 maycontribute to the control of the probe pressure. The elasticity force ofthe beam 4B may absorb the difference of height among the plurality ofelectrodes Wl by making the contactor 4A of the probe 4 contact with theelectrode Wl of the IC chip on the wafer W, and simultaneouslyconnecting the contactor 4A thereof to the electrode W1 thereof.

In FIG. 3, the bump 3 of the probe card main body 2 and the stopper 5provided on necessity may include, e.g., a copper coating layer (30, 50)and an insulating film 5B.

The bump 3 may be configured, i.e., by forming the copper coating layeron the surface of the card main body 2 and by etching a certain portionof the copper coating layer. Or, the copper coating layer 30 and thecopper coating layer 50 may be made by employing a film formingtechnology such as a CVD or a sputtering. On each lower surface of thecopper coating layer 30 of the plurality of bumps 3 may be formed a goldcoating layer 3A while on each lower surface of the copper coating layer50 may be formed a gold coating layer 5B, as shown in FIG. 3. Amanufacturing process may be simplified by making each height of thegold coating layers 3A and 5A equal and forming the insulating film 5Bthereon. The gold coating layer 3A on the bump 3 facilitates theelectrical connection to the probe 4. The height of the bump 3 isdetermined so that the electrode W1 should not contact with the probecard main body 2, for example, 37 μm (including the height of the goldcoating layer, e.g., 2 μm). As shown in FIGS. 2A and 2B schematically,the stopper 5 may be provided to a place such as scrub line, and thelike, which does not contact with the IC chip formed on the wafer W,when the contactor 4A contacting with the electrode W1. As shown in FIG.3, at least a surface of a lower portion of the stopper 5 is preferablycoated by the insulating layer 5B made of, e.g., polyimide. Theinsulating layer 5B may provide the bump 3 with more height from theprobe card main body 2 by the thickness of the insulating layer 5B,e.g., 25 to 30 μm (FIGS. 1A, 1B).

The stopper 5 is preferably formed together with the bump 3 and includesthe copper coating layer 50 and gold coating layer 5A, as describedabove. However, the stopper 5 may possibly include the insulating layer5B only. For a case of including insulating layer 5B only, theinsulating layer 5B also preferably provides more height from the probecard main body 2 by the thickness of the insulating layer 5B, e.g., 25to 30 μm than the bump 3 (FIGS. 1A, 1B).

As shown in FIG. 3, an alignment mark 8 is preferably formed on theprobe card main body 2 for matching a position when attaching the probe4. The alignment mark 8 may be formed by recording a mark on the probecard main body 2 or by adhering a mark thereon. Further, the alignmentmark 8 is formed by performing a hole-making process to the probe cardmain body 2 from the surface thereof to the wiring layer 6 installedtherein by using, e.g., a laser. The alignment mark 8 is certainlydistinguishable by a camera by using the difference of a contrastbetween the wiring layer 6 and the probe card main body 2, which will bedescribed later.

Next, an embodiment of manufacturing the probe will be described withreference to FIGS. 4A, 4B and FIGS. 5A to 5G. A plurality of probes 4may be formed, e.g., on the silicon substrate 10 arranged as shown inFIG. 4A in accordance with the embodiment. When the probes 4 are formedon the silicon substrate 10, the silicon substrate 10 may be dividedinto a plurality of regions (i.e., four regions). In each region, theprobes may be arranged in different directions.

By arraying the probes 4 in the plural directions, there may be acquireda degree of freedom for an attaching direction of each probe whenattaching the base end 4 b 3 of each probe to the bump 3 of the probecard main body 2.

Moreover, the probe 4 may be formed on the silicon substrate 10 with apredetermined arrangement density. An adjustment in the arrangementdensity facilitates a performance of transference from the siliconsubstrate 10 shown in FIG. 5.

Referring to FIGS. 4A and 4B, a plurality of probes 4 may be formed onthe silicon substrate 10 by following a sequence of a lithographytechnology described below.

On the silicon substrate 10, it is performed a Si crystal anisotropyetching by using a conventional etching method (e.g., wet etching usingan alkali family solution). Further, there may be formed a recessedportion (frame) 10A having a substantially trapezoidal shape, preferablyreverse square coned trapezoidal shape. The recessed portion may beformed by performing an etching based on a surface direction and byusing an anisotropy property of the silicon. An extent of a lowersurface of the frame 10A (a top surface 4A1 of the contactor 4A havingthe trapezoidal shape) may be controlled to a predetermined size byadjusting the etching duration. By this controlling thereof, the extentat each lower surface of a plurality of frames 10A formed on the siliconsubstrate 10 may be controlled uniformly. A surface of a leading endpreferably has a shape of a regular square, each side of which is about10 μm.

On the surface of the silicon substrate 10, a plurality of recessedportions 10A being formed thereon, an electrode film (e.g., titan film)401 may be formed, by using a film forming technology (e.g., sputteringtechnology).

By using a gold coating electrode 401, a peeling layer (e.g., a coppercoating layer) 402 may be formed on the surface of an identicalelectrode film with a depth of, e.g., 1 μm.

On the surface of the silicon substrate 10, a resist is sprayed with adepth of, e.g., 25 μm. By performing an exposure, a development and anetching process of a surface of a resist film formed thereby, the resistfilm having a predetermined pattern is formed thereon. On the patternedresist film as shown in FIG. 4A, an opening is formed at a placecorresponding to the plurality of contactors 4A (i.e., a position of theframe 10A) and at a place corresponding to the probes 4.

On the upper surface of the peeling layer 402 exposed at the opening ofthe resist film, a contact layer (e.g., palladium (Pd) layer) 403 of thecontactor 4A is formed. Next, a beam layer (e.g., Nickel (Ni) layer witha depth of 20 μm) 404 is formed. Sequentially, a gold (Au) layer 405having a depth of, e.g., 2 μm may be formed. The gold layer 405 ispreferably formed to facilitate a contact between the bump 3 and thebase end 4 b 3 of the probe 4.

A whole resist film is eliminated. By a process described above, theplurality of probes 4 are formed in an arranged pattern shown in FIG.4A. A cross section of each probe 4 is a layered architecture as shownin FIG. 4B. (FIG. 5A) FIG. 5A shows a sectional view of structure that aplurality of probes 4 are formed on the silicon substrate 10 byabove-described process.

(FIG. 5B) As shown in FIG. 5B, the silicon substrate 10 may be etched toeliminate the peeling layer partially or dimensionally. The etchingprocess may be performed for about 80 seconds for example, by using 5%peroxo ammonium sulfate aquatic solution of a temperature of about 40 °C. Resultantly, the peeling layer 402 is partially eliminated. FIG. 5Bshows a status in which each probe 4 is detachable from the siliconsubstrate 10. At this time, each probe 4 is prevented from beingcompletely detached and moved, by leaving a portion of the peeling layer402 intact. Like this, the portion of the peeling layer 402 is left suchthat the probe is prevented from being moved and derailed in atransference process which will be described afterward. As shown in FIG.5B, the silicon substrate 10 is cleaned and dried after the peelinglayer 402 is eliminated. (FIG. 5C) On the surface of the siliconsubstrate 10 where the probes 4 are formed, a first film-shapedsupporting body (hereinafter, referred to as a first adhesive resinfilm) 11 is installed and the first adhesive resin film is pressed onthe silicon substrate 10 by using, e.g., a roller. The first adhesiveresin film is made of a material such as a vinyl chloride, polyethylene.The first adhesive resin film may have an adhesive property, wherein anadhesiveness is decreased by heating. The first adhesive resin film 11is detached from the silicon substrate 10. By the detaching process,each probe 4 is transferred to the first adhesive resin film 11 as shownin FIG. 5C. Further, there is no possibility for the first adhesiveresin film 11 to be adhered to the silicon substrate 10 by forming aplurality of the probes 4 on the silicon substrate 10 with apredetermined arrangement density.

(FIG. 5D) There is eliminated a portion of the peeling layer 402 left ateach probe 4. As an example of the elimination, the etching process maybe performed for about 20 seconds by using 5% peroxo ammonium sulfateaquatic solution of a temperature of about 40° C. Accordingly, thepeeling layer 402 is completely eliminated and then the first adhesiveresin film 11 is cleaned and dried.

(FIG. 5E) As shown in FIG. 5E, a second film-shaped supporting body(hereinafter, referred to as a second adhesive resin film) 12 is formedon the first adhesive resin film 11, whereby being piled thereon. Atleast one of the first adhesive resin film 11 and the second adhesiveresin film 12 is pressed by, e.g., the roller. The second adhesive resinfilm 12 is made of a material such as a vinyl chloride, polyethylene.The second adhesive resin film 12 may have an adhesive property, whereinthe adhesiveness is decreased by irradiating ultraviolet light thereto.

A process is preferably performed to deteriorate the adhesiveness of thefirst adhesive resin film 11 by, e.g., heating the first adhesive resinfilm 11.

After adhering the second adhesive resin film 12 thereto, the firstadhesive resin film 11 may be heated for about 10 seconds at atemperature of about 100° C. by using a heater 13. By the heatingprocess, the adhesiveness of the first adhesive resin film 11 isdecreased to, e.g., about 1/100 thereof such that the adhesiveness ofthe first adhesive resin film 11 becomes lower than that of the secondadhesive resin film 12. By detaching the first adhesive resin film 11from the second adhesive resin film 12, a plurality of probes 4 on thefirst adhesive film 11 are transferred to the second adhesive resin film12.

Moreover, in case of the high adhesiveness of the first adhesivenessresin film 11, a process for reducing the adhesiveness is furtherpreferably performed in addition to the heating process described above.The process is performed by radiating the ultraviolet light UV from aside of the first adhesive resin film 11 by using, e.g., an ultravioletlight radiating apparatus UV.

(FIG. 5F) As shown in FIG. 5F, there is performed a process todeteriorate the adhesiveness of the portion of the second adhesive resinfilm 12, where each probe 4 is not arranged thereon. The process isperformed by irradiating the ultraviolet light UV to the second adhesiveresin film 12 from a side of the probe 4 with, e.g., the ultravioletlight radiating apparatus UV. The radiation of the ultraviolet lightdeteriorates the adhesiveness of a portion of the second adhesive resinfilm 12, where each probe 4 is not provided thereon. In case of the highadhesiveness of the second adhesiveness resin film 12 to the probe 4,the ultraviolet light may be radiated from the reverse side of thesurface thereof, where the probe 4 is provided thereon. The radiationdiminishes the adhesiveness of the second adhesive resin film 12 to theprobe 4.

(FIG. 5G) As shown in FIG. 5G, the second adhesive resin film 12, whereeach probe 4 is transferred, is preferably maintained by a supportingunit 14 by using a glue, a double-sided tape or the like. Further, thesupporting unit (hereinafter, referred to as a frame body) 14 maymaintain the second adhesive resin film 12 as described later.

A probe attaching apparatus in accordance with the first embodiment isdescribed. The probe attaching apparatus 100 in accordance with theembodiment includes a mounting table 101A for loading thereon the probecard main body 2, a probe supporting unit 103, a probe fixing unit 106and a position detection unit 105.

The mounting table 101A may include a lifting/rotating unit 101B tosupport and move the mounting table 101A in Z and/or θ direction and afirst moving unit 102 to support and move the mounting table 101A in Xand/or Y direction. The mounting table 101A may include a temperaturecontrol unit 101C therein to control a temperature of the card main body2.

The probe supporting unit 103 may support a probe array (the secondadhesive resin film) 12, a plurality of probes being maintained thereondetachably therefrom, to be parallel to the probe card main body 2.Further, the probe supporting unit 103 includes a second moving unit 104movable at least in X and/or Y direction, while maintaining the parallelstatus to the probe card main body 2.

The position detection unit 105 is a unit for detecting each positionthereof to render each supporting column 3 of the probe card main body 2position matched with the base end 4 b 3 of each probe 4 maintained onthe second adhesive resin film 12. Further, the position detection unit105 may be provided with a first CCD camera 105A and a second CCD camera105B.

The probe fixing unit 106 may include a fixing unit (e.g., an ultrasonicbonder) 106for attaching the supporting column 3 of the probe card mainbody 2 to the base end 4 b 3 of the probe 4.

The probe attaching apparatus 100 may include controllers 108A, 108B(for example, including a microcomputer) to control the aforementionedunits in accordance with a previously registered program. Further, thefirst and the second moving units 102, 104 are movably installed on abase table 107.

The lifting/rotating unit 101B may move the mounting table 101A in a Zdirection and a θ direction. The temperature control unit 1O1C providedin the mounting table 1O1A heats up the prove card main body 2 up to thetemperature of, e.g., 80 °C. As shown in FIGS. 6 and 7, the first movingunit 102 may include an X stage 102A moving in an X direction on an Xrail (not shown) and a Y stage 102B supporting the X stage 102A and theX rail. The Y stage 102B moves in a Y direction on a Y rail (not shown)which is supported on the base table 107.

As shown in FIGS. 6 and 7, the second moving unit 104 includes an Xstage 104A moving in an X direction on an X rail (not shown) and a Ystage 104B supporting the X rail. The Y stage 104B moves in a Ydirection on a Y rail (not shown) which is supported by the base table107.

The probe supporting unit 103 includes a supporting column 103A attachedto the X stage 104A of the second moving unit 104 and a frame shapedsupporting portion 103B protruded horizontally from the supportingcolumn 103A. One or more than one supporting column 103A may beprovided. The supporting portion 103B is maintaining a probe supportingbody (frame body) 14 to which the second adhesive resin film 12 isattached with a predetermined tension. A flange 103C is formed in alower portion of an inner circumference of the supporting portion 103Band the flange 103C fastens and fixes an edge portion 14A of the framebody 14.

As exemplified by referring to FIGS. 6 and 7, the detection unit 105includes a first CCD camera 105A photographing the contactor substrate 1on the mounting table 101A from upside, a second CCD camera 105Bphotographing the probe 4 adhered to the second adhesive resin film 12supported by the supporting unit 103 from downside, a lighting device(not shown) for illuminating each of the contactor substrate 1 and theprobe 4 during photographing thereof, an image processor 109 forprocessing an image data delivered from the first and the second CCDcameras 105A and 105B, a displaying unit for displaying the imageprocessed by the image processor 109, and controllers 108A and 108B forcontrolling the first moving unit 102, the second moving unit 104 andthe ultrasonic bonder based on the data given from the image processor109. Each of the first and the second CCD cameras 105A and 105B isinstalled in a predetermined certain fixed place. The second CCD cameramay be installed apart from the mounting table 101A, but preferablyfixed near the mounting table (e.g., to the lifting/rotating unit 101Bas shown in FIG. 6).

Accordingly, the second CCD camera may move in the Z direction alongwith the lifting movement of the lifting/rotating unit 101B. The probefixing unit (e.g., the ultrasonic bonder) 106 includes the bonder 106Aand the bonder main body 106B. Further, the bonder main body 106B mayinclude a lifting unit 106E that may move the bonder 106A in the Zdirection. The bonder 106A may be moved to the place where the probe 4contacts with the bump 3 by the lifting unit 106E of the bonder mainbody 106B.

A designed position information of the target alignment mark 8 isregistered in advance in the controller 108A. The controller 108Acontrols the first moving unit 102 based on the information thereof. Thefirst moving unit 102 moves the mounting table 101A right below thefirst CCD camera 105A.

The mounting table 101A loading thereon the probe card main body 2 ismoved by the lifting/rotating unit 101B in a Z direction and a θdirection and located below the first CCD camera 105A. The first CCDcamera 105A may photograph a central position of the alignment mark 8 inthe probe card main body 2. A photographed coordinate of the mountingtable 101A is delivered to the image processor 109 as real positioninformation of the alignment mark 8 and simultaneously the controllers108A, 108B store the position information thereof. Similarly, thesupporting unit 103 is moved by the second moving unit 104 and locatedat an upper portion of the second CCD camera 105B. The second CCD camera105B photographs the contactor 4A of the target probe 4 arranged in afilm 12. A coordinate of the second moving unit 104 is stored by thecontrollers 108A, 108B as real position information of the contactor 4A.

Meanwhile, distance information and direction information between thetarget alignment mark 8 and an attaching surface 3 a of the bump 3corresponding thereto are already known at a design stage. Consequently,the position information of the bump 3 is automatically outputted basedon the already-known values at the design stage by detecting realposition information of the target alignment mark 8. At this time, aposition where the contactor 4A is fixed to the bump 3 may be outputtedsimilarly. Because each coordinate of the first and the second CCDcameras 105A, 105B and the ultrasonic bonder 106 are already-known, thebase end 4 b 3 of the probe 4 may be automatically position-matched withthe bump 3 of the probe card main body 2. An array direction of theprobe 4 fixed to each bump 3 is previously known. Each probe adapted tothe array direction may be selected among the second adhesive resinfilms 12 supported by the supporting unit 103 with a predeterminedtension.

Next, a method for attaching the probe in accordance with an embodimentof the present invention will be described with reference to FIG. 6. Thesupporting unit (frame body) 14 supports the second film-shapedsupporting body (the second adhesive resin film) 12, which has aplurality of probes 4 arranged in a certain array pattern, with apredetermined tension. The frame body 14 is inserted on the supportingunit 103B of the probe supporting unit 103. The probe card main body 2is loaded on the mounting table 101A, wherein the mounting table 101A ismoved in an X and/or a Y direction by the first moving unit 102 andsimultaneously moved in a θ and/or a Z direction by the lifting/rotatingunit 101B so that the mounting table 101A reaches the right below of thefirst CCD camera 105A. The first CCD camera 105A searches the alignmentmark 8 corresponding to the target bump 3 based on the alignment mark 8position information of the probe card main body 2 registered previouslyin a detection unit controller. At this time, the alignment mark 8corresponding to the target bump 3 may happen to deviate from theposition which is based on the position information previouslyregistered in a detection unit controller by tens of Am, which may becaused by, e.g., a thermal expansion of the probe card main body 2. Theposition deviation is corrected by moving the mounting table 101 in an Xand/or a Y direction precisely, so that the mounting table 101 isarranged at the position of the alignment mark 8 corresponding to thetarget bump 3 right below the first CCD camera 105A. The positiondeviation results from heating the probe card main body 2 with atemperature of, e.g., 80° C to facilitate a contact between the bump 3and the probe 4. The mounting table 101 is moved and the target bump 3is arranged right below the first CCD camera 105A. After confirmingthere is no deviation, the coordinate of the bump 3 is stored by thecontroller. A moving distance at this time is predetermined based on thedesign value of the probe card 1.

The supporting unit 103 is moved in an X and/or a Y direction by thesecond moving unit 104 and located right above the second CCD camera105B. The second moving unit 104 moves the supporting unit precisely inan X and/or a Y direction, while the second CCD camera 105B photographsthe probe 4 arranged on the second film-shaped supporting body (anadhesive resin film) 12. Simultaneously, the second CCD camera 105Bsearches the target contactor 4A of the probe 4 based on a photographedimage of the display unit 110. While the second CCD camera 105Bphotographs the probe 4 arranged on the second adhesive resin film 12,the supporting unit 103 and the second moving unit 104 move the secondadhesive resin film 12 in an X and/or a Y direction. The controllercompensates a design coordinate of the contactor 4A, which will beinitially contacted, with a real coordinate. The controller stores thecompensated value. At this time, moving distances of the supporting unit103 and the second moving unit 104 in an X and a Y direction arecalculated by an operation processing part of the controller. Anadjustment of the supporting unit in a θ direction may be previouslyperformed manually when the frame body 14, fixing the second adhesiveresin film 12 with a predetermined tension, is inserted into thesupporting portion 103B of the probe supporting unit 103.

(FIG. 8A) FIG. 8A shows a status in which each position compensation forthe bump 3 of the probe card main body 2 and the probe 4 of the secondadhesive resin film 12 is completed.

(FIG. 8B) As shown in FIG. 8B, the mounting table 101 is moved by thefirst moving unit 102 and the bump 3 of the probe card main body 2,which will be initially contacted, is moved right below the probe fixingunit 106A. The supporting unit 103 is moved by the second moving unit104 to the upside of the mounting table 101 and the probe 4 of thesecond adhesive resin film 12, which will be initially contacted, ismoved right below the probe fixing unit 106A. A contact surface 3A ofthe bump 3 and the base end 4b3 of the probe 4 are aligned in a straightline right below the bonder 106A. At this time, as indicated by a dasheddot line, X and Y coordinates of the alignment mark 8 coincide withthose of the contactor 4A.

(FIG. 8C) As shown in FIG. 8C, the bump 3 contacts with the base end 4 b3 of the probe 4 by lifting the mounting table 101. At this stage theultrasonic bonder 106A is lowered and attaches the bump 3 to the probe 4by irradiating an ultrasonic wave. At this time, a hole can be easilyformed in the second adhesive resin film 12 by, e.g., a pressure of theultrasonic bonder 106A, thereby an ultrasonic wave attachment beingperformed smoothly.

The bonder 106A of the ultrasonic bonder 106 is lifted and then themounting table 101 is lowered by the lifting/rotating unit 101B. Thefirst and the second moving units 102, 104 performs position matchingbetween the bump 3 and the probe 4 which will be attached next, bymoving the probe card main body 2 and the second adhesive resin film 12.

For the position matching, the detection unit 105 and the controllers108A, 108B correct the real coordinates of the bump 3 and the probe 4.As described in detail, the position matching between the bump 3 and theprobe 4 is performed in such a way that the first and the second movingunits 102, 104 move the mounting table 101 and the supporting unit 103.The ultrasonic bonder 106 is lowered and then attaches both of them. Byperforming the sequential processes above repeatedly, the probes 4 areattached to all the bumps 3 of the card main body 2.

(FIG. 8D) After the probes 4 are attached to all the bumps 3 of the cardmain body 2, if it is necessary to insulate the attached portion, aninsulating material 9A (e.g., polyimide) is spread on the probes 4 andthe bump 3 by an spreading apparatus 111 such as micro-dispenser andthen the probe card 1 having an insulating film 9 thereon is completed,as shown in FIG. 8D.

As described above, in accordance with the first embodiment of thepresent invention, a mass production of the probe 4 is possibleirrespective of kinds of the probe cards 1. Further, the probe 4 and thecontactor 4A are formed together as a single body and applied todifferent kinds of the probe cards 1. Accordingly, there may be providedthe probe 4 having a wide applicability and a good electricalcharacteristic. Since the contactor 4A formed in a trapezoidal shape canmake a stable contact with the electrode pad to thereby make a secureelectrical connection therebetween, a highly reliable inspection can beperformed.

In accordance with the first embodiment, a photomask of any kind is notneeded and the probe cards 4 having various specification may beprovided by attaching the probe 4 to the probe card main body, the probebeing made by one set of photomasks (e.g., 2 sheets). The probe 4 isattached to the bump 3 of the probe card main body 2 individually sothat, when the probe 4 is damaged, a new probe 4 may be attached to theprevious bump 3 instead of the damaged probe. In the probe card mainbody 2, there is provided the stopper 5 limiting the probe pressure ofthe contactor 4A and the electrode pad of the wafer W. The stopper canmaintain the probe pressure at a desirable value and simultaneouslyprevent the probe from being damaged by the excessive probe pressure.The bump 3 and the stopper 5 are provided together on the card main body2, thereby both of them may be formed simultaneously on the card mainbody 2.

The method for manufacturing the probe in accordance with the firstembodiment of the present invention includes: forming the frame lOAcorresponding to the contactor 4A at a plurality of places on thesilicon substrate 10; forming a nickel layer detachably on the siliconsubstrate 10; forming a plurality of probes 4 having the contactor 4Aand the beam 4B, simultaneously by correcting the nickel layerpartially; transferring the probe 4 to the first film-shaped supportingbody (the first adhesive resin film) 11 detachably; and transferring theprobe 4 to the second film-shaped supporting body (the second adhesiveresin film) 12 from the first adhesive resin film 11 detachably.Consequently, there may be manufactured the probes 4 massively which arecommon to various kinds of probe cards.

By arranging a plurality of probes 4 in each of the divided regions(e.g., 4 regions) in such a way that each probe faces a differentdirection in each region, the degree of freedom can be increased whenattaching the probe. By heating the first adhesive resin film 11, theadhesiveness of the first adhesive resin film 11 to the probe 4 isdeteriorated. Accordingly, the probe 4 is transferred securely from thefirst adhesive resin film 11 to the second adhesive resin film 12. Byirradiating the ultraviolet light to the second adhesive resin film 12,the probe 4 is transferred securely to the probe card main body 2 fromthe second adhesive resin film 11. By forming a metal layer on which theprobes are formed with nickel having elasticity, the probe pressureneeded for inspecting the wafer W can be secured and at the same timethe probe 4 may be used repeatedly.

In accordance with the first embodiment of the present invention, theprobe attaching apparatus 100 includes: a mounting table 101 for loadingthereon the probe card main body 2, wherein the mounting table 101 ismovable in X, Y, Z and θ directions; a probe supporting unit 103 forsupporting the second adhesive resin film 12, on which a plurality ofprobes are detachably arrayed thereon, in parallel to the card main body2, wherein the probe supporting unit 103 is movable in X and Ydirections; a position detection unit 105 for detecting a positioninformation to position match the probe card main body 2 with each probe4 of the second adhesive resin film 12; and an ultrasonic bonder 106movable in Z direction (a direction of an arrow A in FIG. 6), attachingthe probe 4 to the probe card main body 2, after position matching step.By moving the probe card main body 2 in X, Y, Z and θ directions andsimultaneously moving the second adhesive resin film 12 in X and Ydirections, wherein a plurality of probes 4 are arranged thereondetachably, the probe 4 and the probe card main body 2 are positionmatched. By attaching the probe 4 to the bump 3 of the probe card mainbody 2 and then detaching the probe 4 from the second adhesive resinfilm 12, a small quantity of many different kinds of probe cards may bemanufactured economically without a photomask to manufacture theoriginal probe 4. When a portion of the probes 4 in the probe card 1 isdamaged, the probe card 1 can be repaired by removing the damaged probe4 and replacing the damaged probe 4 with a new probe 4.

In accordance with the first preferred embodiment of the presentinvention, as a mark for position matching when attaching the probe 4,there may be used the alignment mark 8 provided in the prove card mainbody 2. When attaching the probe 4 to the bump 3 of the probe card mainbody 2, by using the above mark, the probes 4 may be attached to apredetermined place with a high accuracy even when the card main body 2expands thermally. In accordance with the first preferred embodiment,the detection unit 105 includes the first CCD camera 105A photographingthe card main body 2 and the second CCD camera 105B photographing theprobe 4 such that the card main body 2 and the probe 4 can be securelyposition matched with each other.

The present invention is not limited to the preferred embodimentdescribed above and various changes and modifications of each elementmay be made without departing from the spirit and scope of theinvention. In the preferred embodiment above, the probe card 1 isexemplified. However, the preferred embodiment of the present inventionmay be applied to manufacturing of the contactor. In the preferredembodiment, the adhesiveness of the first adhesive resin film 11 isdecreased by heating thereof, and the adhesiveness of the secondadhesive resin film 12 is deteriorated by irradiating the ultravioletlight thereto. However, the reduction of the adhesiveness of eachadhesive resin film may be performed conversely. As an attachingapparatus, other attaching apparatus may be used other than theultrasonic bonder exemplified above.

A process for reducing the adhesiveness of the first adhesive resin filmis performed desirably after piling the second adhesive resin film onthe first adhesive resin film and further after completing the pressingprocess. However, the reducing process may be performed prior to thepressing process or before piling the second adhesive resin film.

A second preferred embodiment of the present invention will now bedescribed.

Referring to FIGS. 9 to 12, there is described a probe array maintenanceunit 14 (hereinafter, referred to as a maintenance unit 14) providedwith the probe in accordance with the preferred embodiment of thepresent invention. FIG. 9 shows one of the preferred embodiments of themaintenance unit 14. The supporting unit 14 for supporting the probearray (e.g., the second adhesive resin film and a plurality of probes)12 includes a first frame shaped structure 14A; a second frame shapedstructure 14B overlapped with the first frame shaped structure 14A; anda locking part 14C fastening and fixing the first and the second frameshaped structures 14A and 14B, which are overlapped with each other.

The second adhesive resin film 12 is supported by the first and thesecond frame shaped structures 14A and 14B, when the first and thesecond frame shaped structures 14A and 14B are in stacked state.

The first frame shaped structure 14A includes a first lower surface14Aa, a first upper surface 14Ab and a first slant surface 14Ac. Thesecond frame shaped structure 14B includes a second lower surface 14Ba,a second upper surface 14Bb, a second slant surface 14Bc and an innerperipheral end 14Bd.

On the first upper surface 14Ab of the first frame shaped structure 14A,there is provided the first slant surface 14Ac declining downward fromthe outer circumference to the inner circumference of the first frameshaped structure 14A. On the second lower surface 14Ba of the secondframe shaped structure 14B, there is provided the second slant surface14Bc declining downward from the outer circumference to the innercircumference of the second frame shaped structure. A slant angle of thesecond slant surface 14Bc is preferably coincident with that of thefirst slant surface 14Ac.

The second adhesive resin film 12 is preferably loaded on the firstframe shaped structure 14A so that a surface, the second adhesive resinfilm 12 being attached thereto, faces the first upper surface 14Ab ofthe first frame shaped structure 14A. For the loading above, the secondadhesive resin film 12 is fixed on the first upper surface 14Ab of thefirst frame shaped structure 14A by using the adhesiveness. At thistime, the second frame shaped structure 14B is piled on the first frameshaped structure 14A. As the second frame shaped structure approachesthe first frame shaped structure, the inner peripheral end 14Bd of thesecond frame shaped structure 14B pushes the second adhesive resin film12 to thereby let it descend downward. In a state that the second frameshaped structure 14B is completely piled on the first frame shapedstructure 14A, the second adhesive resin film 12 is supported by thefirst and the second frame shaped structure 14A and 14B with apredetermined tension.

There may be employed the locking part 14C such as a bolt, magnetic or ageneral stopper. In case of adopting the bolt, the bolt is fixed at thefirst frame shaped structure by penetrating through the second adhesiveresin film 12 and the second frame shaped structure 14B. Consequently,the piled state of the first and the second frame shaped structures ismaintained.

Referring to FIG. 10, another preferred embodiment of the supportingunit 14 is described. The first frame shaped structure 14A includes afirst upper surface 14Ab which is flat and a first vertical surface 14Acaround an outer circumference thereof. The second frame shaped structure14B includes a second upper surface 14Bb which is flat and a secondvertical surface 14Bc around an inner circumference thereof. The secondadhesive resin film 12 is preferably loaded on the first frame shapedstructure 14A so that a surface of the second adhesive resin film 12where the probe is attached faces the second frame shaped structure 14B.

The second adhesive resin film 12 is installed on the surface of thefirst frame shaped structure 14A and then the second frame shapedstructure 14B is piled thereon. As the second frame shaped structure 14Bis piled on the first frame shaped structure 14A, the second adhesiveresin film 12 is pushed downward by the second vertical surface. In astate in which the second frame shaped structure 14B is completely piledon the first frame shaped structure 14A, the second adhesive resin film12 is supported by the first and the second frame shaped structures 14Aand 14B with a certain tension.

For the preferred embodiment shown in FIG. 10, the locking part 14C canfix the first and the second frame shaped structures with the secondadhesive resin film 12 inserted therebetween.

Further, a friction material 14E is provided on the second verticalsurface 14Bc. By employing the friction material 14E on the secondvertical surface 14Bc, the second adhesive resin film 12 is pushed downby a stronger force.

Referring to FIG. 11, another embodiment of the supporting unit 14 willnow be described. As shown in FIG. 11, the supporting unit 14 includesthe first frame shaped structure 14A and the second frame shapedstructure 14B. The first frame shaped structure 14A includes the firstupper surface 14Ab and the first upper surface 14Ab has the first slantsurface 14Ac declining from the inner circumference to the outercircumference of the first frame shaped structure. The second frameshaped structure 14B has a second lower surface 14Ba and similarly thesecond lower surface 14Ba has the second slant surface 14Bc decliningfrom the inner circumference to the outer circumference of the secondframe shaped structure. The second slant surface 14Bc preferably has asame slant angle as that of the first slant surface 14Ac. The secondadhesive resin film 12 is preferably arranged on the first frame shapedstructure 14A with a predetermined tension so that a surface of thesecond adhesive resin film 12, where the probe is attached, faces thesecond frame shaped structure 14B (a first arrangement example).However, the second adhesive resin film 12 is preferably arranged on thefirst frame shaped structure 14A so that a surface of the secondadhesive resin film 12, where the probe is attached, faces the firstframe shaped structure 14A to use the adhesiveness of the secondadhesive resin film 12 (a second arrangement example).

In the first arrangement example, the second frame shaped structure 14Bis piled on the first frame shaped structure 14A. In a state in whichthe second frame shaped structure 14B is completely piled on the firstframe shaped structure 14A, the second adhesive resin film 12 issupported by the first and the second frame shaped structures 14A and14B with a certain tension.

In the second arrangement example, the second adhesive resin film 12 isadhered to the first upper surface of the first frame shaped structure14A by using the adhesiveness thereof. Accordingly, the second frameshaped structure 14B is piled on the first frame shaped structure 14A ina state in which the second adhesive resin film 12 is attached to thefirst frame shaped structure 14A with a certain predetermined tension.Similar to the first arrangement example, the second adhesive resin film12 is supported by the first and the second frame shaped structures 14Aand 14B with a predetermined tension.

For the embodiments of the supporting unit 14 shown in FIGS. 9 to 12,each of the first frame shaped structure 14A is preferably provided witha cut off portion 14D to be fixed to the probe attaching unit at theouter circumference boundary of the first lower surface 14Aa. The cutoff portion 14D is effectively used to securely load the probe arraysupporting unit 14 on the supporting unit 13 shown in FIG. 6.

As shown in FIG. 15A, the probe attached to the bump 3 of the probe cardmain body 2 includes the beam 4B, and the beam 4B is preferably benttoward the contactor 4A near the base end 4 b 3.

In an inspection state shown in FIG. 15B, the contactor 4A of the bentprobe 4 provides a margin to absorb a difference of the heights withrespect to the electrode pad W1. Resultantly, the contactor 4A of theprobe 4 may be connected to the electrode pad Wi securely.

The probe 4 having the bent beam 4B is manufactured after making astraight beam or after providing the beam 4B with the contactor 4A, bybending the beam 4B near the base end 4 b 3 of the beam 4B. Further, theprobe 4 having the bent beam 4B may be manufactured by forming the beamby using the frame with a bent structure.

Moreover, the beam 4B is bent at the attaching step thereof byresearching the means for attaching the probe 4 to the bump 3.

Referring to FIGS. 13 and 14, cases of researching the means forattaching is described.

As shown in FIG. 13A, the bump 3 of the probe card main body 2 whichwill be initially contacted and the probe 4 of the second adhesive resinfilm 12 which will be initially contacted are position matched with eachother. A contact surface 3A of the bump 3 and the base end 4b3 of theprobe 4 are aligned in a straight line right below the bonder 106A. Atthis time, as indicated by a dash dotted line in FIG. 13A, X and Ycoordinates of the alignment mark 8 coincide with those of the contactor4A.

As shown in FIG. 13B, the bump 3 contacts with the base end 4 b 3 of theprobe 4. At this time, the leading end of the ultrasonic bonder 106Apresses the bump 3 and the base end of the probe 4. The bump 3 and theprobe 4 are attached with each other by using energy from the ultrasonicbonder 106A.

The leading end 106C of the ultrasonic bonder 106A is preferablyprovided with a protrusion shape such as a threesome intersection shapeor a crossing shape as shown in FIG. 14. The protrusion is preferably acrossing shape. A cross section of the protrusion has a form of atriangle, a semicircle or the like. The cross section of the protrusionis preferably of a semicircle shape.

By using the ultrasonic bonder having the protrusion 106D, as shown inFIG. 13B, the base end of the probe 4 is attached to the bump 3. Asshown in FIG. 13C, the beam 4B of the probe 4 may be bent toward thecontactor at one of the intermediate portion and the base end of theprobe 4 and at the same time can be fixed to the bump 3 strongly. By thebending thereof, the leading end of the probe 4 is preferably raisedfrom the contact part by 10 μm. After the probes 4 are attached to allthe bumps 3 of the card main body 2, if it is necessary to insulate theattached portion, an insulating material 9A is spread on the probe 4 andthe bump 3 by a spreading apparatus 111 such as micro-dispenser and theprobe card 1 having an insulating film 9 thereon is completed, as shownin FIG. 13D.

INDUSTRIAL APPLICABILITY

In accordance with the first and the second embodiment of the presentinvention, there are provided a probe and a method thereof for massproducing the probe used commonly to the various probe cards, each ofwhich having a different array pattern.

In accordance with the first and the second embodiment of the presentinvention, a small quantity of many kinds of the probe cards aremanufactured economically without a photomask to manufacture theoriginal probe.

There are provided a probe attaching method and an apparatus thereof formanufacturing various probe cards at a low cost, by using one kind ofthe probe.

In accordance with the present invention, it is provided a probe cardmanufactured by attaching one kind of the probe based on the arraythereof.

It will be understood by those skilled in the art that anothercharacteristics and modifications may be made. Accordingly, the presentinvention is based on a wide aspect and not limited by the preferredembodiments described herein.

Therefore, various changes and modifications may be made withoutdeparting from the spirit and scope of the invention as defined in thefollowing claims and equivalents thereof.

While the invention has been shown and described with respect to thepreferred embodiments, it will be understood by those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1. A probe array for use in a manufacturing process of a probe card,comprising: a second film-shaped supporting body having elasticity; anda plurality of probes adhered onto one surface of the second film-shapedsupporting body, each probe including a beam and a contactor having asubstantially trapezoidal shape, an inner part of the contactor beingessentially filled with one or more metals, wherein the beam has aleading end portion, an intermediate portion and a base end portion, theleading end portion being a portion for making a contact with a testsubject via the contactor, the base end portion being a portion forfixing each probe on the probe card; and the contactor is installed todisposed at the leading end portion of the beam, a top portion of thecontactor being embedded in the second film-shaped supporting body. 2.The probe array of claim 1, wherein at least portions of said onesurface of the second film-shaped supporting body where the probes areattached have an adhesive property, and an adhesive strength thereof canbe varied by heat or ultraviolet light.
 3. The probe array of claim 1,wherein the plurality of probes are arranged in various directions onthe second film-shaped supporting body.